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RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
8200-9055-81

8200-9055-81

RFI GASKET ELASTOMER

Leader Tech Inc.

2,598 16.88
RFQ
8200-9055-81

Datasheet

- Bulk Active Gasket - - - - Conductive Elastomer - - - -62°C ~ 260°C
0097056019

0097056019

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

3,736 19.34
RFQ

-

- Bulk Active Fingerstock - 0.190" (4.83mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
0097055519

0097055519

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

1,888 15.73
RFQ
0097055519

Datasheet

Twist Bulk Active Fingerstock - 0.340" (8.64mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
0077001417

0077001417

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

1,233 19.50
RFQ

-

77 Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.220" (5.59mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
0077001419

0077001419

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

3,502 19.50
RFQ

-

77 Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.220" (5.59mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
37-131-1039-09600

37-131-1039-09600

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

4,810 0.00
RFQ
37-131-1039-09600

Datasheet

SOFT-SHIELD® 3700 Box Active Fabric Over Foam Rectangle 0.591" (15.00mm) 8.00' (2.44m) 0.387" (9.83mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
0097056417

0097056417

RFI FINGERSTOCK BECU TIN CLIP

Laird Technologies EMI

4,545 15.89
RFQ
0097056417

Datasheet

Clip-On Twist Bulk Active Fingerstock - 0.210" (5.33mm) 16.000" (406.40mm) 0.140" (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip 121°C
0098054102

0098054102

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

3,297 15.89
RFQ

-

Ultrasoft Foldover Bulk Active Fingerstock - 0.380" (9.65mm) 16.000" (406.40mm) 0.120" (3.05mm) Beryllium Copper - - Adhesive 121°C
0098095417

0098095417

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

1,851 15.95
RFQ

-

Ultrasoft Symmetrical (S3) Slotted Bulk Active Fingerstock - 0.450" (11.43mm) 15.000" (381.00mm) 0.140" (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
4208PA51G07200

4208PA51G07200

RFI FOF GASKET ADH

Laird Technologies EMI

2,362 22.96
RFQ
4208PA51G07200

Datasheet

51G Bulk Active Fabric Over Foam Rectangle 0.394" (10.00mm) 72.000" (182.88cm) 1.000" (25.40mm) - - - Adhesive -
8516-0120-72

8516-0120-72

RFI GASKET

Laird Technologies EMI

1,260 20.94
RFQ

-

Electroseal™ Bulk Active Gasket - 1.031" (26.19mm) - - - - - - -
0097055919

0097055919

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

2,214 16.07
RFQ
0097055919

Datasheet

Twist Bulk Active Fingerstock - 0.300" (7.62mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
11-45CD-BD-16

11-45CD-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

2,290 18.75
RFQ
11-45CD-BD-16

Datasheet

- Bulk Active Fingerstock - 0.450" (11.43mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
387012273

387012273

UFR,BECU,SBNI,RL 0.5

Laird Technologies EMI

3,811 0.00
RFQ

-

Ultraflex Bulk Active - - - - - - - - - -
0C98044002

0C98044002

RFI FINGERSTOCK BECU UNPLAT ADH

Laird Technologies EMI

3,182 20.15
RFQ

-

Ultrasoft Large Enclosure Bulk Active Fingerstock - 1.630" (41.40mm) 25.00' (7.60m) 0.410" (10.41mm) Beryllium Copper Unplated - Adhesive 121°C
0097029019

0097029019

RFI FINGERSTOCK NICKEL

Laird Technologies EMI

3,479 20.14
RFQ

-

- Bulk Active Fingerstock - - - - - Nickel 299.21µin (7.60µm) - 121°C
13-37AH-BD-16

13-37AH-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

2,849 18.75
RFQ
13-37AH-BD-16

Datasheet

- Bulk Active Fingerstock - 0.370" (9.40mm) 16.000" (406.40mm) 0.130" (3.30mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
14-S-37FSV30-BD-16

14-S-37FSV30-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

2,807 18.75
RFQ

-

- Bulk Active Fingerstock - 0.370" (9.40mm) 16.000" (406.40mm) 0.140" (3.56mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
7-13U-BD-12

7-13U-BD-12

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

4,488 18.75
RFQ
7-13U-BD-12

Datasheet

- Bulk Active Fingerstock - 0.130" (3.30mm) 12.000" (304.80mm) 0.070" (1.78mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
4358PA51H09600

4358PA51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

1,023 23.39
RFQ
4358PA51H09600

Datasheet

51H Bulk Active Fabric Over Foam D-Shape 0.098" (2.50mm) 96.000" (2.44m) 0.059" (1.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
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