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RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
0098054002

0098054002

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

2,649 16.37
RFQ

-

Ultrasoft All-Purpose Bulk Active Fingerstock - 0.280" (7.11mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper - - Adhesive 121°C
0097054017

0097054017

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

1,176 20.34
RFQ
0097054017

Datasheet

All-Purpose Bulk Active Fingerstock - 0.280" (7.11mm) 15.984" (406.00mm) 0.110" (2.79mm) Beryllium Copper Tin 299.99µin (7.62µm) Adhesive 121°C
4520AC51K09600

4520AC51K09600

RFI FOF GASKET PU

Laird Technologies EMI

4,935 23.50
RFQ
4520AC51K09600

Datasheet

51K Bulk Active Fabric Over Foam Square 2.000" (50.80mm) 96.000" (2.44m) 2.000" (50.80mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
25-78FS-BD-85.875-NTP

25-78FS-BD-85.875-NTP

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

4,146 16.90
RFQ
25-78FS-BD-85.875-NTP

Datasheet

- Bulk Active Fingerstock - 0.780" (19.81mm) 85.920" (2.18m) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
0078007217

0078007217

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

4,924 16.53
RFQ
0078007217

Datasheet

Ultrasoft Hook-on Bulk Active Fingerstock - 0.600" (15.24mm) 16.200" (411.48mm) 0.152" (3.86mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot 121°C
4688PA51H09600

4688PA51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

3,185 23.75
RFQ
4688PA51H09600

Datasheet

51H Bulk Active Fabric Over Foam Rectangle 0.118" (3.00mm) 96.000" (2.44m) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
37-131-1007-09600

37-131-1007-09600

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

4,152 0.00
RFQ
37-131-1007-09600

Datasheet

SOFT-SHIELD® 3700 Box Active Fabric Over Foam Rectangle 1.614" (41.00mm) 8.00' (2.44m) 0.075" (1.91mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
0097054219

0097054219

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

2,207 16.61
RFQ
0097054219

Datasheet

Foldover Bulk Active Fingerstock - 0.250" (6.35mm) 15.984" (406.00mm) 0.080" (2.03mm) Beryllium Copper Nickel 299.99µin (7.62µm) Adhesive 121°C
0097060719

0097060719

RFI FINGERSTOCK BECU NICKEL CLIP

Laird Technologies EMI

1,579 20.63
RFQ

-

- Bulk Active Fingerstock - - 16.000" (406.40mm) 0.170" (4.32mm) Beryllium Copper Nickel 299.21µin (7.60µm) Clip 121°C
0098053817

0098053817

AP,STR,SNB,USF,PSA/.250X.780X.37

Laird Technologies EMI

4,273 0.00
RFQ

-

* Bulk Active - - - - - - - - - -
0C97044017

0C97044017

RFI FINGERSTOCK BECU TIN HARDWR

Laird Technologies EMI

3,631 19.58
RFQ
0C97044017

Datasheet

Large Enclosure Bulk Active Fingerstock - 1.630" (41.40mm) 25.00' (7.60m) 0.410" (10.41mm) Beryllium Copper Tin 299.99µin (7.62µm) Hardware, Rivet, Solder 121°C
8516-0359-56

8516-0359-56

MILCONNECTOR,MIM613 35.12X30.15X

Laird Technologies EMI

4,337 22.15
RFQ

-

MIL Connector Bulk Active - - - - - - - - - -
8864-0110-93

8864-0110-93

RFI GASKET

Laird Technologies EMI

1,792 18.57
RFQ

-

Electroseal™ Bulk Active Gasket Round 0.250" (6.35mm) - 0.250" (6.35mm) - - - - -
4358PA51G09600

4358PA51G09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

2,948 24.47
RFQ

-

51G Bulk Active Fabric Over Foam D-Shape 0.098" (2.49mm) 8.00' (2.44m) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 85°C
0098051502

0098051502

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

4,364 17.10
RFQ

-

Ultrasoft Foldover Bulk Active Fingerstock - 0.760" (19.30mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper - 299.21µin (7.60µm) Adhesive 121°C
4912PA51H08400

4912PA51H08400

RFI FOF GASKET PU ADH

Laird Technologies EMI

3,978 24.51
RFQ

-

ECOGREEN™ Bulk Active Fabric Over Foam D-Shape 0.150" (3.81mm) 7.00' (2.13m) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
13-30RH-SN-0.356

13-30RH-SN-0.356

RFI FINGERSTOCK BECU TIN ADH

Leader Tech Inc.

1,798 18.75
RFQ
13-30RH-SN-0.356

Datasheet

- Bulk Active Fingerstock - 0.300" (7.62mm) 0.356" (9.04mm) 0.130" (3.30mm) Beryllium Copper Tin Flash Adhesive -55°C ~ 121°C
3-S-23T-BD-24-NTP

3-S-23T-BD-24-NTP

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

4,057 18.75
RFQ
3-S-23T-BD-24-NTP

Datasheet

- Bulk Active Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
7-19PCI-SS-14.6

7-19PCI-SS-14.6

RFI FINGERSTOCK BECU ADH

Leader Tech Inc.

1,891 18.75
RFQ
7-19PCI-SS-14.6

Datasheet

- Bulk Active Fingerstock - 0.180" (4.57mm) 14.600" (370.84mm) 0.070" (1.78mm) Beryllium Copper - - Adhesive -55°C ~ 121°C
7-19PCI-SS-4.6

7-19PCI-SS-4.6

RFI FINGERSTOCK BECU ADH

Leader Tech Inc.

4,286 18.75
RFQ
7-19PCI-SS-4.6

Datasheet

- Bulk Active Fingerstock - 0.180" (4.57mm) 4.600" (116.84mm) 0.070" (1.78mm) Beryllium Copper - - Adhesive -55°C ~ 121°C
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