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Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
507302B00000G HEATSINK TO-220 2.5W LOW PROFILE Boyd Laconia, LLC	31,204	0.27	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Bolt On	Square, Fins	0.750" (19.05mm)	0.750" (19.05mm)	-	0.380" (9.65mm)	2.5W @ 60°C	10.00°C/W @ 200 LFM	24.00°C/W	Aluminum	Black Anodized
574502B00000G HEATSINK TO-220 VERT MNT .75" Boyd Laconia, LLC	39,642	0.37	RFQ	Datasheet	-	Bag	Active	Board Level	TO-220	Clip	Rectangular, Fins	0.750" (19.05mm)	0.860" (21.84mm)	-	0.395" (10.03mm)	3.0W @ 60°C	8.00°C/W @ 400 LFM	21.20°C/W	Aluminum	Black Anodized
290-1AB HEATSINK TO-220 VERT/HORZ BLK Wakefield-Vette	4,488	0.49	RFQ	Datasheet	290	Bulk	Active	Board Level	TO-218, TO-202, TO-220	Bolt On	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	2.0W @ 44°C	7.00°C/W @ 400 LFM	22.00°C/W	Aluminum	Black Anodized
V-1100-SMD/B-L HEAT SINK COPPER DPAK TO-252 Assmann WSW Components	6,405	0.47	RFQ	Datasheet	-	Bulk	Active	Top Mount	TO-252 (DPak)	SMD Pad	Rectangular, Fins	0.320" (8.13mm)	0.790" (20.07mm)	-	0.390" (9.91mm)	-	-	25.00°C/W	Copper	Tin
V-1100-SMD/A-L HEATSINK TO-263 12.70X26.20MM Assmann WSW Components	4,987	0.48	RFQ	Datasheet	-	Bulk	Active	Top Mount	TO-263 (D²Pak)	SMD Pad	Rectangular, Fins	0.500" (12.70mm)	1.031" (26.20mm)	-	0.390" (9.91mm)	-	-	23.00°C/W	Copper	Tin
577102B04000G HEATSINK TO-220 W/TAB .375" Boyd Laconia, LLC	21,002	0.67	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.375" (9.52mm)	1.0W @ 30°C	8.00°C/W @ 400 LFM	25.90°C/W	Aluminum	Black Anodized
V2017B HEATSINK ANOD ALUM CPU Assmann WSW Components	3,057	0.55	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	-	Square, Pin Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.275" (7.00mm)	-	-	31.00°C/W	Aluminum	Black Anodized
V6560W HEATSINK ALUM ANOD Assmann WSW Components	4,885	0.57	RFQ	Datasheet	-	Tray	Active	Board Level	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.984" (25.00mm)	1.181" (30.00mm)	-	0.472" (12.00mm)	-	-	10.00°C/W	Aluminum	Black Anodized
V-1100-SMD/B HEAT SINK COPPER DPAK TO-252 Assmann WSW Components	14,896	0.65	RFQ	Datasheet	-	Tape & Reel (TR)	Active	Top Mount	TO-252 (DPak)	SMD Pad	Rectangular, Fins	0.320" (8.13mm)	0.790" (20.07mm)	-	0.390" (9.91mm)	-	-	25.00°C/W	Copper	Tin
287-1ABE HEATSINK FOR TO220 Wakefield-Vette	3,947	0.78	RFQ	Datasheet	287	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	4.0W @ 65°C	7.80°C/W @ 200 LFM	16.20°C/W	Aluminum	Black Anodized
577202B00000G HEAT SINK TO-220 .500" COMPACT Boyd Laconia, LLC	11,197	0.39	RFQ	Datasheet	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.500" (12.70mm)	1.5W @ 40°C	10.00°C/W @ 200 LFM	24.40°C/W	Aluminum	Black Anodized
576802B04000G HEAT SINK VERT PLUG-IN TO-220 Boyd Laconia, LLC	12,560	0.67	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220, TO-262	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 30°C	7.00°C/W @ 400 LFM	27.30°C/W	Aluminum	Black Anodized
577102B00000G HEAT SINK TO-220 .375" COMPACT Boyd Laconia, LLC	778	0.43	RFQ	Datasheet	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.375" (9.52mm)	3.0W @ 80°C	12.00°C/W @ 200 LFM	25.90°C/W	Aluminum	Black Anodized
110991327 HEAT SINK KIT FOR RASPBERRY PI 4 Seeed Technology Co., Ltd	22,678	0.99	RFQ	Datasheet	-	Bulk	Active	Top Mount Kit	Raspberry Pi 4B	Adhesive	-	-	-	-	-	-	-	-	Aluminum	-
573300D00010G HEATSINK D2PAK .4" HIGH SMD Boyd Laconia, LLC	21,954	1.01	RFQ	Datasheet	-	Tape & Reel (TR)	Active	Top Mount	TO-263 (D²Pak)	SMD Pad	Rectangular, Fins	0.500" (12.70mm)	1.030" (26.16mm)	-	0.400" (10.16mm)	1.3W @ 30°C	10.00°C/W @ 200 LFM	18.00°C/W	Aluminum	Tin
658-25AB HEATSINK CPU 28MM SQ BLK Wakefield-Vette	10,734	1.03	RFQ	Datasheet	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
HSB05-171711 HEAT SINK, BGA, 17 X 17 X 11.5 M Same Sky (Formerly CUI Devices)	6,249	1.08	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.453" (11.50mm)	3.1W @ 75°C	8.40°C/W @ 200 LFM	23.91°C/W	Aluminum Alloy	Black Anodized
574502B03300G HEATSINK TO-220 VERT MNT W/TAB Boyd Laconia, LLC	8,221	2.88	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.810" (20.57mm)	-	0.390" (9.91mm)	3.0W @ 60°C	6.00°C/W @ 600 LFM	21.20°C/W	Aluminum	Black Anodized
658-60AB HEATSINK CPU 28MM SQ BLK W/OTAPE Wakefield-Vette	133	1.29	RFQ	Datasheet	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.598" (15.20mm)	2.5W @ 30°C	2.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
573100D00010G HEATSINK SMT D-PAK/TO-252 TIN Boyd Laconia, LLC	11,190	1.19	RFQ	Datasheet	5731	Tape & Reel (TR)	Active	Top Mount	TO-252 (DPak)	SMD Pad	Rectangular, Fins	0.315" (8.00mm)	0.900" (22.86mm)	-	0.400" (10.16mm)	0.8W @ 30°C	12.50°C/W @ 600 LFM	26.00°C/W	Aluminum	Tin

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