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Heat Sinks

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
KU-0334-AL-ST-1,2MM-3-A-VE-SG

KU-0334-AL-ST-1,2MM-3-A-VE-SG

KU-0334-AL-ST-1,2MM-3-A-VE-SG

Boyd Laconia, LLC

1,405 0.00
RFQ

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- Bulk Active - - - - - - - - - - - - -
342941-COPPER SKIVFIN

342941-COPPER SKIVFIN

342941,REV04(GP)

Boyd Laconia, LLC

2,417 0.00
RFQ

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- Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Rectangular, Fins 1.594" (40.50mm) 1.575" (40.00mm) - 0.531" (13.50mm) - - - Copper -
6296BG PINS

6296BG PINS

HTSK-AL-16372-25.4-B-PINS-(ML97/

Boyd Laconia, LLC

2,872 0.00
RFQ

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- Bulk Active Board Level, Vertical TO-218, TO-220 Bolt On and PC Pin Rectangular, Fins 1.650" (41.91mm) 0.992" (25.20mm) - 1.000" (25.40mm) - - 5.23°C/W Aluminum Black Anodized
530862B05162/MOD.HOLEG

530862B05162/MOD.HOLEG

202337-0002 REV B

Boyd Laconia, LLC

2,109 0.00
RFQ

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- Bulk Active - - - - - - - - - - - - -
10-6327-01G + T725 PAD

10-6327-01G + T725 PAD

10-6327-01G + T725 PAD

Boyd Laconia, LLC

4,929 0.00
RFQ

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- Bulk Active Board Level BGA, FPGA Push Pin Square, Pin Fins 1.122" (28.50mm) 1.122" (28.50mm) - 0.394" (10.00mm) 1.0W @ 30°C 8.00°C/W @ 300 LFM - Aluminum Black Anodized
66100-2167

66100-2167

HEAT SINK(RD002371)66100-2167 RE

Boyd Laconia, LLC

1,318 0.00
RFQ

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- Bulk Active - - - - - - - - - - - - -
371924B00034G

371924B00034G

H/S ASS'Y 35*35*13.97MM PGA,3719

Boyd Laconia, LLC

2,805 0.00
RFQ

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- Bulk Active Top Mount BGA, FPGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.550" (13.97mm) 3.0W @ 60°C 4.00°C/W @ 300 LFM - Aluminum Black Anodized
3293-1

3293-1

3293-2,REV A(GP)

Boyd Laconia, LLC

1,072 0.00
RFQ

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- Bulk Active - - - - - - - - - - - - -
SW25-4G

SW25-4G

THM,ZA3288 ISS 5 SW25-4

Boyd Laconia, LLC

3,945 0.00
RFQ

-

- Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 0.492" (12.50mm) 1.359" (34.50mm) - 0.984" (25.00mm) 2.0W @ 30°C 6.50°C/W @ 200 LFM 11.40°C/W Aluminum Black Anodized
476400U00000G

476400U00000G

BFIN,476400U00000G

Boyd Laconia, LLC

3,509 0.00
RFQ

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- Bulk Active - - - - - - - - - - - - -
342949-COPPER SKIVFIN

342949-COPPER SKIVFIN

342949

Boyd Laconia, LLC

4,709 0.00
RFQ

-

- Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 3.150" (80.00mm) 3.150" (80.00mm) - 0.472" (12.00mm) - - - Copper -
6032B-TTG

6032B-TTG

THM,10824B-TT REV U(COPPER)G

Boyd Laconia, LLC

4,021 0.00
RFQ

-

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.380" (35.05mm) 0.500" (12.70mm) - 2.000" (50.80mm) 2.0W @ 30°C 5.00°C/W @ 200 LFM - Copper Black Anodized
KU-SBK-0451-ES-ST-0,7MM-SG

KU-SBK-0451-ES-ST-0,7MM-SG

KU-SBK-0451-ES-ST-0,7MM-SG

Boyd Laconia, LLC

4,978 0.00
RFQ

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- Bulk Active - - - - - - - - - - - - -
TV35G

TV35G

HTSK-AL-TV35-B-@-(TV35G ZA1609

Boyd Laconia, LLC

3,829 0.00
RFQ

-

- Bulk Active Board Level TO-220 Clip and PC Pin Rectangular, Fins 1.496" (38.00mm) 1.654" (42.00mm) - 0.984" (25.00mm) 3.0W @ 20°C 5.00°C/W @ 200 LFM 7.20°C/W Aluminum Black Anodized
374424B00000G

374424B00000G

374424B00000G HS (GP)

Boyd Laconia, LLC

3,210 0.00
RFQ

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- Bulk Active - - - - - - - - - - - - -
241404B91203G

241404B91203G

FG,241404B91203G,REV 01(GP)

Boyd Laconia, LLC

3,563 0.00
RFQ

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- Bulk Active - - - - - - - - - - - - -
7022B-TC11-MTG

7022B-TC11-MTG

THM,7022B-TC11-MTG

Boyd Laconia, LLC

3,185 0.00
RFQ

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- Bulk Active Board Level, Vertical TO-220 Clip and PC Pin, Bolt On Rectangular, Fins 1.986" (50.44mm) 0.375" (9.53mm) - 1.968" (49.99mm) 10.0W @ 70°C 3.00°C/W @ 400 LFM 6.50°C/W Aluminum Black Anodized
10-6327-01,MOD EARS

10-6327-01,MOD EARS

10-6327-01 MOD EARS,REV 00,00,04

Boyd Laconia, LLC

4,237 0.00
RFQ

-

- Bulk Active Top Mount BGA Push Pin Square, Pin Fins 1.122" (28.50mm) 1.122" (28.50mm) - 0.394" (10.00mm) - 9.26°C/W @ 200 LFM 30.60°C/W Aluminum Black Anodized
2288BG

2288BG

2288BG

Boyd Laconia, LLC

2,629 0.00
RFQ

-

- Bulk Active Board Level BGA Thermal Tape, Adhesive (Not Included) Cylindrical - - 0.300" (7.62mm) ID, 1.000" (25.40mm) OD - 1.5W @ 40°C 8.00°C/W @ 400 LFM - - -
KU-SBK-0383-ES-ST-0,3MM-SG

KU-SBK-0383-ES-ST-0,3MM-SG

KU-SBK-0383-ES-ST-0,3MM-SG

Boyd Laconia, LLC

3,436 0.00
RFQ

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- Bulk Active - - - - - - - - - - - - -
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