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Heat Sinks

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
V7466Y4

V7466Y4

PROFILE HEATSINK

Assmann WSW Components

4,195 0.00
RFQ

-

- Bulk Active Board Level, Vertical SOT-32, TO-220, TOP-3 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.772" (45.00mm) - 0.500" (12.70mm) - - 6.20°C/W Aluminum Alloy Black Anodized
328990006

328990006

HEAT SINK FOR CUBIEBOARD

Seeed Technology Co., Ltd

3,873 0.00
RFQ

-

- Bulk Obsolete Top Mount - Adhesive Square, Fins 0.750" (19.05mm) 0.750" (19.05mm) - 0.205" (5.21mm) - - - - -
642-35ABT3

642-35ABT3

HEAT SINK WITH THERMAL TAPE

Wakefield-Vette

1,781 1.38
RFQ
642-35ABT3

Datasheet

642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.350" (8.89mm) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
642-35ABT5

642-35ABT5

HEATSINK FOR 35MM BGA

Wakefield-Vette

4,288 1.39
RFQ
642-35ABT5

Datasheet

642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.350" (8.89mm) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
V4330C

V4330C

PROFILE HEATSINK

Assmann WSW Components

3,097 0.00
RFQ

-

- Bulk Active - - - - - - - - - - - - -
V9733E3-LP

V9733E3-LP

PROFILE HEATSINK

Assmann WSW Components

1,622 0.00
RFQ

-

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.654" (42.00mm) - 0.984" (25.00mm) 4.0W @ 20°C 1.50°C/W @ 400 LFM 4.80°C/W Aluminum Alloy Black Anodized
V6716ZA12

V6716ZA12

PROFILE HEATSINK

Assmann WSW Components

1,818 0.00
RFQ

-

- Bulk Active - - - - - - - - - - - - -
374224B00035G

374224B00035G

374224B00035G

Boyd Laconia, LLC

3,225 0.00
RFQ

-

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.984" (25.00mm) 3.0W @ 60°C 6.37°C/W @ 200 LFM 19.70°C/W Aluminum Black Anodized
667-10ABSPE

667-10ABSPE

HEATSINK TO-220 W/S/O PINS BLK

Wakefield-Vette

1,673 1.47
RFQ
667-10ABSPE

Datasheet

667 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.500" (12.70mm) 1.375" (34.93mm) - 1.000" (25.40mm) 6.0W @ 76°C 5.80°C/W @ 200 LFM - Aluminum Black Anodized
TV5G

TV5G

PRESSED HEATSINK, TV5G, ZA0779/7

Boyd Laconia, LLC

1,691 0.00
RFQ

-

- Bulk Active Board Level, Vertical TO-220 Bolt On Rectangular, Fins 0.748" (19.00mm) 0.866" (22.00mm) - 0.748" (19.00mm) 3.0W @ 40°C 12.00°C/W @ 300 LFM - Aluminum Black Anodized
624-35ABT1E

624-35ABT1E

HEATSINK FOR 21MM BGA

Wakefield-Vette

2,435 1.27
RFQ
624-35ABT1E

Datasheet

624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.350" (8.89mm) - 15.00°C/W @ 400 LFM - Aluminum Black Anodized
624-35ABT4E

624-35ABT4E

HEATSINK FOR 21MM BGA

Wakefield-Vette

2,104 1.51
RFQ
624-35ABT4E

Datasheet

624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.350" (8.89mm) - 15.00°C/W @ 400 LFM - Aluminum Black Anodized
V9772W1

V9772W1

PROFILE HEATSINK

Assmann WSW Components

2,213 0.00
RFQ

-

- Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 0.984" (25.00mm) 2.559" (65.00mm) - 0.709" (18.00mm) - - 7.90°C/W Aluminum Alloy Black Anodized
642-45ABT1E

642-45ABT1E

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,755 1.33
RFQ
642-45ABT1E

Datasheet

642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.450" (11.43mm) - 6.00°C/W @ 500 LFM - Aluminum Black Anodized
642-45ABT4E

642-45ABT4E

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,137 1.47
RFQ
642-45ABT4E

Datasheet

642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.450" (11.43mm) - 6.00°C/W @ 500 LFM - Aluminum Black Anodized
HSE-B18381-0396H

HSE-B18381-0396H

HEAT SINK, EXTRUSION, TO-218, 38

Same Sky (Formerly CUI Devices)

3,419 1.38
RFQ
HSE-B18381-0396H

Datasheet

HSE Box Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Angled Fins 1.500" (38.10mm) 1.654" (42.00mm) - 0.984" (25.00mm) 10.8W @ 75°C 2.29°C/W @ 200 LFM 6.94°C/W Aluminum Alloy Black Anodized
374324B00032G

374324B00032G

374324B00032G

Boyd Laconia, LLC

2,684 0.00
RFQ

-

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.394" (10.00mm) 1.5W @ 40°C 9.35°C/W @ 200 LFM 30.60°C/W Aluminum Black Anodized
XL25-50-50-5-T1-0.25

XL25-50-50-5-T1-0.25

CERAMIC HEAT SPREADER 50X50MM GR

t-Global Technology

2,166 1.53
RFQ
XL25-50-50-5-T1-0.25

Datasheet

XL-25 Tray Obsolete Heat Spreader Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square 1.969" (50.00mm) 1.969" (50.00mm) - 0.197" (5.00mm) - - - Ceramic -
7021B-MT6G

7021B-MT6G

HEAT SINK

Boyd Laconia, LLC

1,776 1.56
RFQ
7021B-MT6G

Datasheet

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.750" (44.45mm) 1.450" (36.83mm) - 0.380" (9.65mm) 6.0W @ 50°C 4.00°C/W @ 300 LFM 6.80°C/W Aluminum Black Anodized
630-45ABT4E

630-45ABT4E

HEATSINK FOR BGAS FIN HGT .45"

Wakefield-Vette

1,383 1.50
RFQ
630-45ABT4E

Datasheet

630 Bulk Active Top Mount BGA Adhesive Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.450" (11.43mm) - 4.00°C/W @ 400 LFM - Aluminum Black Anodized
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