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Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
630-60ABT5 HEATSINK FOR 35MM BGA Wakefield-Vette	2,850	1.57	RFQ	Datasheet	630	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.600" (15.24mm)	-	3.00°C/W @ 350 LFM	-	Aluminum	Black Anodized
658-35ABT6 HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	1,674	1.68	RFQ	Datasheet	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.350" (8.89mm)	-	3.00°C/W @ 800 LFM	-	Aluminum	Black Anodized
677-20ABP HEATSINK MULTIWATT 2.0" BLK Wakefield-Vette	2,819	1.73	RFQ	Datasheet	677	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247, Multiwatt	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	6.0W @ 40°C	2.50°C/W @ 200 LFM	6.70°C/W	Aluminum	Black Anodized
502203B00000 HEAT SINK 6W/.75"H SPACE SAVER Boyd Laconia, LLC	4,076	1.73	RFQ	Datasheet	-	Bag	Active	Board Level	-	Bolt On	Rhombus	1.630" (41.40mm)	1.290" (32.77mm)	-	0.750" (19.05mm)	-	-	-	Aluminum	Black Anodized
V2201N1-F-LP HEATSINK CPU W/ADHESIVE STAMPED Assmann WSW Components	2,921	1.47	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Fins	1.457" (37.00mm)	1.457" (37.00mm)	-	0.551" (14.00mm)	-	-	-	Aluminum Alloy	Natural Anodized
V9733E4-LP PROFILE HEATSINK Assmann WSW Components	1,380	0.00	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	2.500" (63.50mm)	1.654" (42.00mm)	-	0.984" (25.00mm)	8.0W @ 30°C	1.00°C/W @ 400 LFM	4.20°C/W	Aluminum Alloy	Black Anodized
630-45ABT5 HEATSINK FOR 35MM BGA Wakefield-Vette	1,137	1.60	RFQ	Datasheet	630	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.450" (11.43mm)	-	4.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
HSE-B18508-060H-W HEAT SINK, EXTRUSION,TO-218, 50. Same Sky (Formerly CUI Devices)	4,544	1.63	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Angled Fins	2.000" (50.80mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	12.8W @ 75°C	2.98°C/W @ 200 LFM	5.86°C/W	Aluminum Alloy	Black Anodized
V7466Z4 PROFILE HEATSINK Assmann WSW Components	2,309	0.00	RFQ	-	-	Bulk	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	2.500" (63.50mm)	1.772" (45.00mm)	-	0.500" (12.70mm)	-	-	5.60°C/W	Aluminum Alloy	Black Anodized
576802B00000,MOD (038326) 576802B00000,MOD TAB (038326) Boyd Laconia, LLC	4,913	0.00	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
V9772X1 PROFILE HEATSINK Assmann WSW Components	4,638	0.00	RFQ	-	-	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.476" (37.50mm)	2.559" (65.00mm)	-	0.709" (18.00mm)	-	-	6.40°C/W	Aluminum Alloy	Black Anodized
ATS-PCBM1101 BOARD LEVEL HEAT SINK Advanced Thermal Solutions Inc.	3,451	0.00	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	-	2.50°C/W @ 200 LFM	3.50°C/W	Aluminum	Black Anodized
658-25ABT5 HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	2,341	1.61	RFQ	Datasheet	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
642-25ABT1E HEATSINK FOR 35MM BGA Wakefield-Vette	4,353	1.35	RFQ	Datasheet	642	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.250" (6.35mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
BDN10-3CB TYPE: TOP MOUNT / SHAPE: SQUARE CTS Thermal Management Products	1,741	0.00	RFQ	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
HSE-B18318-0396H HEAT SINK, EXTRUSION,TO-218, 31. Same Sky (Formerly CUI Devices)	2,648	1.66	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Angled Fins	1.250" (31.75mm)	1.654" (42.00mm)	-	0.984" (25.00mm)	9.1W @ 75°C	2.57°C/W @ 200 LFM	8.24°C/W	Aluminum Alloy	Black Anodized
637-25ABPE HEATSINK TO-220 VERT MT BLK 2.5" Wakefield-Vette	3,017	1.37	RFQ	Datasheet	637	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	2.500" (63.50mm)	1.375" (34.93mm)	-	0.500" (12.70mm)	6.0W @ 48°C	4.20°C/W @ 200 LFM	-	Aluminum	Black Anodized
6273BG HEATSINK Boyd Laconia, LLC	2,142	1.40	RFQ	Datasheet	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
625-35ABT3 HEATSINK FOR 25MM BGA Wakefield-Vette	4,659	1.41	RFQ	Datasheet	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.350" (8.89mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
625-35ABT5 HEATSINK FOR 25MM BGA Wakefield-Vette	3,871	1.66	RFQ	Datasheet	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.350" (8.89mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized

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