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Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
628-20ABT5 HEATSINK FOR 45MM BGA Wakefield-Vette	1,077	1.79	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.200" (5.08mm)	4.0W @ 80°C	8.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
374124B60023G 374124B60023G Boyd Laconia, LLC	1,447	0.00	RFQ	-	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.709" (18.00mm)	1.0W @ 30°C	7.40°C/W @ 200 LFM	23.40°C/W	Aluminum	Black Anodized
667-25ABPPE HEATSINK TO-220 W/S/O PINS BLK Wakefield-Vette	3,005	1.93	RFQ	Datasheet	667	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.375" (34.93mm)	-	2.500" (63.50mm)	6.0W @ 48°C	4.20°C/W @ 200 LFM	-	Aluminum	Black Anodized
ATS-PCBM1105 BOARD LEVEL HEAT SINK Advanced Thermal Solutions Inc.	1,686	0.00	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	-	1.30°C/W @ 200 LFM	3.40°C/W	Aluminum	Black Anodized
630-25ABT4E HEATSINK FOR 35MM BGA Wakefield-Vette	2,415	1.28	RFQ	Datasheet	630	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.250" (6.35mm)	-	7.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
HSE-B18508-0396H HEAT SINK, EXTRUSION, TO-218, 50 Same Sky (Formerly CUI Devices)	2,017	1.73	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Angled Fins	2.000" (50.80mm)	1.654" (42.00mm)	-	0.984" (25.00mm)	12.8W @ 75°C	2.45°C/W @ 200 LFM	5.86°C/W	Aluminum Alloy	Black Anodized
2342B HEAT SINK Boyd Laconia, LLC	1,840	1.95	RFQ	Datasheet	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Rectangular, Pin Fins	1.756" (44.60mm)	1.799" (45.70mm)	-	0.275" (7.00mm)	-	7.26°C/W @ 200 LFM	23.10°C/W	Ceramic	Black Anodized
624-45ABT5 HEATSINK FOR 21MM BGA Wakefield-Vette	2,150	1.83	RFQ	Datasheet	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.450" (11.43mm)	-	15.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
642-25ABT4E HEATSINK FOR 35MM BGA Wakefield-Vette	4,231	1.40	RFQ	Datasheet	642	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.250" (6.35mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
658-45ABT5 HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	1,705	1.68	RFQ	Datasheet	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.450" (11.43mm)	3.0W @ 50°C	6.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
508222B00000 BOARD LEVEL HEAT SINK Boyd Laconia, LLC	2,834	1.97	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220 (Dual)	Bolt On	Rectangular, Fins	1.780" (45.21mm)	1.780" (45.21mm)	-	1.000" (25.40mm)	9.0W @ 50°C	1.00°C/W @ 900 LFM	7.40°C/W	Aluminum	Black Anodized
PF433G MRP/PF433 HEATSINK Boyd Laconia, LLC	4,053	0.00	RFQ	-	-	Bulk	Active	Board Level	TO-220, TO-262	PC Pin	Rectangular, Fins	0.767" (19.50mm)	0.500" (12.70mm)	-	0.512" (13.00mm)	2.5W @ 60°C	7.00°C/W @ 500 LFM	20.30°C/W	Aluminum	Black Anodized
628-25ABT5 HEATSINK FOR 45MM BGA Wakefield-Vette	2,764	1.83	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.250" (6.35mm)	4.5W @ 80°C	7.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
ATS-PCBM1102 BOARD LEVEL HEAT SINK Advanced Thermal Solutions Inc.	4,661	0.00	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	2.500" (63.50mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	-	2.50°C/W @ 200 LFM	3.10°C/W	Aluminum	Black Anodized
V9772Y1 PROFILE HEATSINK Assmann WSW Components	2,014	0.00	RFQ	-	-	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.969" (50.00mm)	2.559" (65.00mm)	-	0.709" (18.00mm)	-	-	4.90°C/W	Aluminum Alloy	Black Anodized
625-45ABT3 HEATSINK CPU 25MM SQ W/DBL TAPE Wakefield-Vette	3,087	1.51	RFQ	Datasheet	625	Bulk	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.450" (11.43mm)	-	8.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
625-45ABT5 HEATSINK FOR 25MM BGA Wakefield-Vette	4,396	1.65	RFQ	Datasheet	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.450" (11.43mm)	-	8.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
7038BG BOARD LEVEL HEAT SINK Boyd Laconia, LLC	3,717	1.86	RFQ	Datasheet	-	Bulk	Active	Board Level	Multiwatt, SIP	Clip	Rectangular, Fins	0.620" (15.75mm)	0.915" (23.24mm)	-	0.380" (9.65mm)	1.5W @ 40°C	6.00°C/W @ 600 LFM	16.00°C/W	Aluminum	Black Anodized
658-60ABT5 HEATSINK EXTRUSION 27MM Wakefield-Vette	4,399	1.76	RFQ	Datasheet	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.600" (15.24mm)	2.5W @ 30°C	2.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
527-24AB HEATSINK DC/DC HALF BRICK VERT Wakefield-Vette	1,845	2.05	RFQ	Datasheet	527	Bulk	Active	Board Level	Half Brick DC/DC Converter	Bolt On, Thermal Material	Rectangular, Fins	2.280" (57.91mm)	2.400" (60.96mm)	-	0.950" (24.13mm)	5.0W @ 60°C	4.20°C/W @ 300 LFM	-	Aluminum	Black Anodized

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