Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
SC1148 ACTIVE COOLER Raspberry Pi	775	0.00	RFQ	-	-	Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
7109DG TOP MOUNT HEATSINK .45" D2PAK Boyd Laconia, LLC	5,401	1.47	RFQ	Datasheet	-	Bag	Active	Top Mount	TO-263 (D²Pak)	SMD Pad	Rectangular, Fins	0.763" (19.38mm)	1.000" (25.40mm)	-	0.450" (11.43mm)	2.0W @ 30°C	3.00°C/W @ 300 LFM	11.00°C/W	Copper	Tin
BDN18-3CB/A01 HEATSINK CPU W/ADHESIVE 1.81"SQ CTS Thermal Management Products	354	5.19	RFQ	Datasheet	BDN	Box	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.810" (45.97mm)	1.810" (45.97mm)	-	0.355" (9.02mm)	-	3.50°C/W @ 400 LFM	10.80°C/W	Aluminum	Black Anodized
901-19-2-12-2-B-0 HEATSINK 19X19X12MM PIN Wakefield-Vette	2,598	6.82	RFQ	Datasheet	901	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	0.457" (11.60mm)	-	6.60°C/W @ 200 LFM	12.70°C/W	Aluminum	Black Anodized
APF19-19-06CB/A01 HEATSINK FORGED W/ADHESIVE TAPE CTS Thermal Management Products	839	5.72	RFQ	Datasheet	APF	Box	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	0.250" (6.35mm)	-	7.10°C/W @ 200 LFM	-	Aluminum	Black Anodized
531002B02500G HEATSINK TO-220 W/PINS 1" TALL Boyd Laconia, LLC	584	1.48	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.375" (34.93mm)	-	0.500" (12.70mm)	2.0W @ 30°C	4.00°C/W @ 400 LFM	13.40°C/W	Aluminum	Black Anodized
APF19-19-10CB/A01 HEATSINK FORGED W/ADHESIVE TAPE CTS Thermal Management Products	3,434	5.61	RFQ	Datasheet	APF	Box	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	0.370" (9.40mm)	-	5.30°C/W @ 200 LFM	-	Aluminum	Black Anodized
ATS-54270D-C1-R0 HEAT SINK 27MM X 27MM X 9.5MM Advanced Thermal Solutions Inc.	2,391	7.36	RFQ	Datasheet	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.374" (9.50mm)	-	14.10°C/W @ 200 LFM	-	Aluminum	Black Anodized
ATS-CPX060060006-205-C2-R0 HEATSINK 60X60X6MM XCUT CP Advanced Thermal Solutions Inc.	213	6.29	RFQ	Datasheet	pushPIN™	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	2.362" (60.00mm)	2.362" (60.00mm)	-	0.236" (6.00mm)	-	13.00°C/W @ 100 LFM	-	Aluminum	Blue Anodized
C40-058-AE HEATSINK FOR TO-247 TO-264 Ohmite	1,168	7.03	RFQ	Datasheet	C40	Box	Active	Board Level, Vertical	TO-247, TO-264, SOT-227	Clip and Board Mounts	Rectangular, Fins	2.283" (58.00mm)	1.724" (43.79mm)	-	1.260" (32.00mm)	-	-	-	Aluminum	Black Anodized
ATS-P1-138-C2-R0 HEATSINK 25X25X15MM L-TAB T766 Advanced Thermal Solutions Inc.	965	4.99	RFQ	Datasheet	pushPIN™	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.590" (15.00mm)	-	12.18°C/W @ 100 LFM	-	Aluminum	Blue Anodized
BDN18-6CB/A01 HEATSINK CPU W/ADHESIVE 1.81"SQ CTS Thermal Management Products	349	5.74	RFQ	Datasheet	BDN	Box	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.810" (45.97mm)	1.810" (45.97mm)	-	0.605" (15.37mm)	-	2.80°C/W @ 400 LFM	8.10°C/W	Aluminum	Black Anodized
ATS-TI1OP-521-C1-R1 HEAT SINK FOR TI MOD #TPA3130D Advanced Thermal Solutions Inc.	9,137	0.00	RFQ	Datasheet	-	Bulk	Active	Top Mount	-	Bolt On	Rectangular, Fins	1.969" (50.00mm)	0.547" (13.89mm)	-	0.984" (25.00mm)	-	8.50°C/W @ 200 LFM	-	Aluminum	Black Anodized
593002B03400G HEATSINK TWISTED FIN TO-220 Boyd Laconia, LLC	7,169	4.48	RFQ	Datasheet	Channel 5900	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.180" (29.97mm)	0.942" (23.93mm)	-	0.500" (12.70mm)	1.0W @ 20°C	4.00°C/W @ 600 LFM	13.40°C/W	Aluminum	Black Anodized
532702B02500G HEATSINK TO-220 SOLDERPIN 50.8MM Boyd Laconia, LLC	484	5.33	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	10.0W @ 50°C	2.00°C/W @ 300 LFM	4.80°C/W	Aluminum	Black Anodized
ATS-56001-C1-R0 HEAT SINK 19MM X 19MM X 9MM Advanced Thermal Solutions Inc.	2,924	0.00	RFQ	Datasheet	maxiFLOW	Bulk	Active	Top Mount	ASIC	Thermal Tape, Adhesive (Included)	Square, Angled Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	0.354" (9.00mm)	-	5.30°C/W @ 200 LFM	-	Aluminum	Black Anodized
APF30-30-13CB/A01 HEATSINK FORGED W/ADHESIVE TAPE CTS Thermal Management Products	403	7.69	RFQ	Datasheet	APF	Box	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Fins	1.181" (30.00mm)	1.181" (30.00mm)	-	0.500" (12.70mm)	-	2.50°C/W @ 200 LFM	-	Aluminum	Black Anodized
ATS-54150D-C1-R0 HEAT SINK 15MM X 15MM X 9.5MM Advanced Thermal Solutions Inc.	1,564	6.93	RFQ	Datasheet	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Fins	0.591" (15.00mm)	0.591" (15.00mm)	-	0.374" (9.50mm)	-	26.20°C/W @ 200 LFM	-	Aluminum	Black Anodized
APF40-40-06CB/A01 HEATSINK FORGED W/ADHESIVE TAPE CTS Thermal Management Products	608	7.51	RFQ	Datasheet	APF	Box	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.250" (6.35mm)	-	3.30°C/W @ 200 LFM	-	Aluminum	Black Anodized
ATS-55170D-C1-R0 HEAT SINK 17MM X 17MM X 9.5MM Advanced Thermal Solutions Inc.	2,059	7.14	RFQ	Datasheet	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.374" (9.50mm)	-	28.00°C/W @ 200 LFM	-	Aluminum	Black Anodized

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