Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
577304B00000G HEATSINK TO-202 LOW PROFILE.375" Boyd Laconia, LLC	4,267	1.51	RFQ	Datasheet	-	Bag	Active	Board Level	TO-202	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.375" (9.52mm)	1.0W @ 30°C	8.00°C/W @ 500 LFM	27.20°C/W	Aluminum	Black Anodized
V5220L HEATSINK ALUM ANOD TO-220 Assmann WSW Components	1,684	1.48	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.181" (30.00mm)	1.260" (32.00mm)	-	0.787" (19.99mm)	-	-	8.00°C/W	Aluminum	Black Anodized
PRT-18704 HEATSINK - 13.20 X 12.10 MM (COP SparkFun Electronics	1,643	0.00	RFQ	-	-	Box	Active	Top Mount	-	Thermal Tape	Rectangular, Fins	0.520" (13.20mm)	0.476" (12.10mm)	-	-	-	-	-	Copper	-
658-25ABT4E HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	2,619	2.32	RFQ	Datasheet	658	Bulk	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
374324B00035G HEATSINK BGA W/ADHESIVE TAPE Boyd Laconia, LLC	3,044	2.54	RFQ	Datasheet	37432	Box	Active	Board Level	BGA, FPGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.394" (10.00mm)	3.0W @ 90°C	9.30°C/W @ 200 LFM	30.60°C/W	Aluminum	Black Anodized
AATS014014010-SF-3I HEATSINK 14X14X10MM Advanced Thermal Solutions Inc.	1,967	0.00	RFQ	-	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Fins	0.551" (14.00mm)	0.551" (14.00mm)	-	0.394" (10.00mm)	-	19.32°C/W @ 200 LFM	-	Aluminum	Black Anodized
658-45ABT4E HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	2,364	2.55	RFQ	Datasheet	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.450" (11.43mm)	3.0W @ 50°C	6.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
219-263A TO-263 HEAT SINK ANODZD Wakefield-Vette	1,687	2.74	RFQ	Datasheet	219	Bulk	Active	Top Mount	TO-263 (D²Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.020" (25.91mm)	-	0.480" (12.19mm)	2.0W @ 30°C	8.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
DA-T268-101E-TR TO-268 HEAT SINK /POLY TAPE Ohmite	1,571	1.89	RFQ	Datasheet	D	Tape & Reel (TR)	Active	Top Mount	TO-268 (D³Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.220" (30.99mm)	-	0.400" (10.16mm)	5.0W @ 35°C	6.00°C/W @ 600 LFM	-	Aluminum	Black Anodized
V2032B HEATSINK CPU FORGED Assmann WSW Components	4,343	2.44	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.728" (18.50mm)	-	-	5.00°C/W	Aluminum Alloy	Black Anodized
XL25D-TO247-22-17-0.64 CERAMIC HEAT SPREADER 22X17X0.63 t-Global Technology	1,982	2.96	RFQ	Datasheet	XL-25	Bulk	Active	Heat Spreader	TO-247	Thermal Tape	Rectangular	0.866" (22.00mm)	0.669" (17.00mm)	-	0.025" (0.64mm)	-	-	-	Ceramic	-
HSB37-404023 HEAT SINK, BGA, 40 X 40 X 23 MM Same Sky (Formerly CUI Devices)	3,654	0.00	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.905" (23.00mm)	11.7W @ 75°C	2.10°C/W @ 200 LFM	6.43°C/W	Aluminum Alloy	Black Anodized
547-45AB HEATSINK DC/DC QUARTER BRICK Wakefield-Vette	4,242	2.52	RFQ	Datasheet	547	Bulk	Active	Board Level, Vertical	Quarter Brick DC/DC Converter	Bolt On, Thermal Material	Rectangular, Fins	1.450" (36.83mm)	2.280" (57.91mm)	-	0.450" (11.43mm)	-	2.10°C/W @ 300 LFM	-	Aluminum	Black Anodized
374624B00032G HEATSINK BGA 35X35X10MM W/ADH Boyd Laconia, LLC	1,247	3.72	RFQ	Datasheet	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.394" (10.00mm)	1.5W @ 40°C	7.60°C/W @ 200 LFM	23.40°C/W	Aluminum	Black Anodized
E2A-T247-38E BLACK ANODIZED HEATSINK Ohmite	4,510	2.32	RFQ	Datasheet	EX	Box	Active	Board Level, Vertical	TO-247	Bolt On and Board Mounts	Rectangular, Fins	0.641" (16.28mm)	0.642" (16.30mm)	-	1.500" (38.10mm)	4.0W @ 70°C	4.00°C/W @ 300 LFM	14.00°C/W	Aluminum	Black Anodized
375024B00032G HEATSINK BGA W/ADHESIVE TAPE Boyd Laconia, LLC	1,809	3.11	RFQ	Datasheet	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.01mm)	-	0.709" (18.00mm)	2.0W @ 30°C	4.30°C/W @ 200 LFM	12.00°C/W	Aluminum	Black Anodized
WAVE-23-165 ANCHOR HEATSINK 23X23X16.5MM Wakefield-Vette	2,515	3.76	RFQ	Datasheet	Wave 2x	Bulk	Active	Board Level	BGA	Clip	Square, Angled Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.650" (16.51mm)	-	5.08°C/W @ 200 LFM	-	Aluminum Alloy	Black Anodized
ATS-CPX030030010-141-C2-R0 HEATSINK 30X30X10MM L-TAB CP Advanced Thermal Solutions Inc.	100	3.86	RFQ	Datasheet	pushPIN™	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	1.181" (30.00mm)	1.181" (30.00mm)	-	0.394" (10.00mm)	-	15.71°C/W @ 100 LFM	-	Aluminum	Blue Anodized
XL25D-TO247-22-17-1 CERAMIC HEAT SPREADER 22X17X1MM t-Global Technology	2,755	3.95	RFQ	Datasheet	XL-25	Bulk	Active	Heat Spreader	TO-247	Thermal Tape	Rectangular	0.866" (22.00mm)	0.669" (17.00mm)	-	0.039" (1.00mm)	-	-	-	Ceramic	-
567-94AB 1/8 BRICK HEATSINK 57.9X55X23.9M Wakefield-Vette	2,147	4.03	RFQ	Datasheet	567	Bulk	Active	Top Mount	Eighth Brick DC/DC Converter	Bolt On, Thermal Material	Rectangular, Fins	2.280" (57.90mm)	2.165" (55.00mm)	-	0.940" (23.88mm)	-	2.20°C/W @ 300 LFM	2.20°C/W	-	Unfinished

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