Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
625-35AB HEATSINK FOR 25MM BGA Wakefield-Vette	348	1.06	RFQ	Datasheet	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.350" (8.89mm)	-	13.10°C/W @ 200 LFM	-	Aluminum	Black Anodized
657-10ABPE HEATSINK TO-220 W/PINS BLK 1" Wakefield-Vette	807	0.87	RFQ	Datasheet	657	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	6.0W @ 41°C	3.70°C/W @ 200 LFM	-	Aluminum	Black Anodized
288-1ABE HEATSINK FOR TO220 Wakefield-Vette	3,312	0.86	RFQ	Datasheet	288	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.250" (31.75mm)	0.875" (22.22mm)	-	0.215" (5.46mm)	4.0W @ 85°C	12.00°C/W @ 600 LFM	21.20°C/W	Aluminum	Black Anodized
HSB32-232318 HEAT SINK, BGA, 23 X 23 X 18 MM, Same Sky (Formerly CUI Devices)	615	0.00	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.709" (18.00mm)	5.9W @ 75°C	4.40°C/W @ 200 LFM	12.67°C/W	Aluminum Alloy	Black Anodized
628-25AB HEATSINK FOR 45MM BGA Wakefield-Vette	2,991	1.21	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.250" (6.35mm)	4.5W @ 80°C	7.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
624-35AB HEATSINK FOR 21MM BGA Wakefield-Vette	5,444	0.96	RFQ	Datasheet	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.350" (8.89mm)	-	15.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
HSB33-272710 HEAT SINK, BGA, 27 X 27 X 10 MM, Same Sky (Formerly CUI Devices)	1,044	0.00	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.394" (10.00mm)	4.4W @ 75°C	5.30°C/W @ 200 LFM	17.22°C/W	Aluminum Alloy	Black Anodized
657-20ABPNE HEATSINK TO-220 W/PINS BLK 2" Wakefield-Vette	1,000	1.42	RFQ	Datasheet	657	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	2.000" (50.80mm)	6.0W @ 32°C	2.90°C/W @ 200 LFM	-	Aluminum	Black Anodized
659-65AB HEATSINK EXTRUSION 37MM Wakefield-Vette	759	1.11	RFQ	Datasheet	659	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.450" (36.83mm)	1.450" (36.83mm)	-	0.650" (16.51mm)	2.0W @ 20°C	1.50°C/W @ 600 LFM	-	Aluminum	Black Anodized
624-60AB HEATSINK FOR 21MM BGA Wakefield-Vette	521	1.11	RFQ	Datasheet	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.600" (15.24mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
625-60AB HEATSINK FOR 25MM BGA Wakefield-Vette	329	1.21	RFQ	Datasheet	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.600" (15.24mm)	-	8.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
628-35AB HEATSINK FOR 45MM BGA Wakefield-Vette	1,997	1.33	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.350" (8.89mm)	3.0W @ 50°C	10.00°C/W @ 150 LFM	-	Aluminum	Black Anodized
ATS-PCBT1086 HEATSINK TO-220 W/TAB BLACK Advanced Thermal Solutions Inc.	989	2.42	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.250" (31.75mm)	0.875" (22.22mm)	-	0.250" (6.35mm)	-	9.50°C/W @ 200 LFM	22.00°C/W	Aluminum	Black Anodized
627-15ABPE HEATSINK FOR TO218/TO220 Wakefield-Vette	410	1.40	RFQ	Datasheet	627	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.375" (34.93mm)	-	1.500" (38.10mm)	6.0W @ 65°C	5.50°C/W @ 200 LFM	-	Aluminum	Black Anodized
626-20ABPE HEATSINK FOR TO218/TO220 Wakefield-Vette	186	1.60	RFQ	Datasheet	626	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.375" (34.93mm)	-	2.000" (50.80mm)	6.0W @ 55°C	4.70°C/W @ 200 LFM	-	Aluminum	Black Anodized
657-25ABPNE HEATSINK TO-220 W/PINS BLK 2.5" Wakefield-Vette	970	1.51	RFQ	Datasheet	657	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	2.500" (63.50mm)	6.0W @ 25°C	2.70°C/W @ 200 LFM	-	Aluminum	Black Anodized
655-26AB HEATSINK FOR 40MM BGA Wakefield-Vette	3,946	1.67	RFQ	Datasheet	655	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.600" (40.64mm)	1.600" (40.64mm)	-	0.260" (6.60mm)	5.0W @ 60°C	3.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
677-10ABPE HEATSINK Wakefield-Vette	1,988	1.70	RFQ	-	677	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247, Multiwatt	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	-	3.10°C/W @ 200 LFM	-	Aluminum	Black Anodized
HSB41-303014P HEAT SINK, BGA, 30 X 30 X 10 MM, Same Sky (Formerly CUI Devices)	410	0.00	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.181" (30.00mm)	1.181" (30.00mm)	-	0.551" (14.00mm)	5.9W @ 75°C	4.30°C/W @ 200 LFM	12.63°C/W	Aluminum Alloy	Black Anodized
HSB39-252509P HEAT SINK, BGA, 25 X 25 X 9 MM, Same Sky (Formerly CUI Devices)	341	0.00	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.354" (9.00mm)	4.3W @ 75°C	6.30°C/W @ 200 LFM	17.53°C/W	Aluminum Alloy	Black Anodized

Total 122183 Record«Prev 1... 56 57 58 596061 62 63...6110 Next»

PRODUCT

PHONE

USER