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Heat Sinks

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
512-3M

512-3M

HEATSINK FOR PWR MOD/IGBT/RELAY

Wakefield-Vette

4,824 49.34
RFQ
512-3M

Datasheet

512 Bulk Active Top Mount Power Modules Adhesive Rectangular, Fins 3.000" (76.20mm) 7.200" (182.88mm) - 2.350" (59.69mm) - - 0.90°C/W Aluminum -
342945-COPPER SKIVFIN

342945-COPPER SKIVFIN

342945,REV03(GP)

Boyd Laconia, LLC

1,726 0.00
RFQ

-

- Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.551" (14.00mm) - - - Copper -
342947-COPPER SKIVFIN

342947-COPPER SKIVFIN

342947,REV02(GP)

Boyd Laconia, LLC

1,157 0.00
RFQ

-

- Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Rectangular, Fins 2.323" (59.00mm) 2.280" (57.91mm) - 0.433" (11.00mm) - - - Copper -
125380

125380

5WX36" EXTRUSION 16414 XX7332

Wakefield-Vette

3,609 46.39
RFQ
125380

Datasheet

- Box Active Top Mount, Extrusion Power Modules Adhesive Rectangular, Fins 36.000" (914.40mm) 5.000" (127.00mm) - 1.500" (38.10mm) - - 0.63°C/W Aluminum -
342943-COPPER SKIVFIN

342943-COPPER SKIVFIN

342943

Boyd Laconia, LLC

1,572 0.00
RFQ

-

- Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 1.969" (50.00mm) 1.969" (50.00mm) - 0.551" (14.00mm) - - - Copper -
HSF-48-19-Y-F

HSF-48-19-Y-F

FANSINK 5VDC 47.5X47.5X18.5MM

Wakefield-Vette

1,303 46.81
RFQ
HSF-48-19-Y-F

Datasheet

HSF Bulk Active Top Mount BGA Clip Square, Fins 1.870" (47.50mm) 1.870" (47.50mm) - 0.728" (18.50mm) - - 1.41°C/W Aluminum Alloy Black Anodized
HSF-48-19-B-F

HSF-48-19-B-F

FANSINK 5VDC 47.5X47.5X18.5MM

Wakefield-Vette

3,855 46.81
RFQ
HSF-48-19-B-F

Datasheet

HSF Bulk Active Top Mount BGA Clip Square, Fins 1.870" (47.50mm) 1.870" (47.50mm) - 0.728" (18.50mm) - - 1.41°C/W Aluminum Alloy Black Anodized
KK0729-02TE

KK0729-02TE

HEATSPREADER FOR TE0729-02

Trenz Electronic GmbH

1,802 47.25
RFQ
KK0729-02TE

Datasheet

TE0729 Bulk Obsolete Heat Spreader TE0729-02 Bolt On Rectangular 2.992" (76.00mm) 2.047" (52.00mm) - 0.354" (9.00mm) - - - - -
125436

125436

8.35WX12" EXTRUSION 13668 XX4937

Wakefield-Vette

4,035 57.76
RFQ
125436

Datasheet

- Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 12.000" (304.80mm) 8.350" (212.09mm) - 2.000" (50.80mm) - - 0.23°C/W Aluminum -
125488

125488

4.75X36" EXTRUSION 4530 XX1024

Wakefield-Vette

2,215 48.65
RFQ
125488

Datasheet

- Box Active Board Level, Extrusion - Bolt On Rectangular, Fins 36.000" (914.40mm) 4.750" (120.65mm) - 1.245" (31.62mm) - - 0.50°C/W Aluminum -
SF4P2U-F004-A01

SF4P2U-F004-A01

Intel Socket 2011 Series 145W 2U

Cooltron Industrial Supply

4,045 0.00
RFQ
SF4P2U-F004-A01

Datasheet

2011 Bulk Active Top Mount with Fan Intel LGA2011 2U Active CPU Cooler Push Pin Rectangular, Fins 3.524" (89.50mm) 3.524" (89.50mm) - 2.519" (64.00mm) 145.0W @ 25.1°C - 0.17°C/W Aluminum, Copper -
KK0714-02

KK0714-02

HEATSPREADER FOR TE0714-02

Trenz Electronic GmbH

2,460 48.00
RFQ

-

TE0714 Bulk Discontinued at Digi-Key Heat Spreader TE0714-02 Bolt On Rectangular 1.575" (40.00mm) 1.181" (30.00mm) - 0.236" (6.00mm) - - - - -
1101A

1101A

THM,10761A REV --G

Boyd Laconia, LLC

3,195 0.00
RFQ

-

- Bulk Active - - - - - - - - - - - - -
SAR365ASX150MM

SAR365ASX150MM

EXTRUDED HEATSINK 216X150MM

Sarnikon

1,342 49.70
RFQ
SAR365ASX150MM

Datasheet

365AS Bulk Active Top Mount - Thermal Tape, Adhesive Rectangular, Fins 5.906" (150.00mm) 8.504" (216.00mm) - 3.268" (83.00mm) - - - Aluminum Natural Anodized
HSF-55-35-B-F

HSF-55-35-B-F

FANSINK 12VDC 55X55X35.1MM

Wakefield-Vette

4,671 50.21
RFQ
HSF-55-35-B-F

Datasheet

HSF Bulk Active Top Mount BGA Clip Square, Fins 2.165" (55.00mm) 2.165" (55.00mm) - 1.303" (33.10mm) - - 0.59°C/W Aluminum Alloy Black Anodized
476K

476K

HEATSINK MED HEXTYPE

Wakefield-Vette

3,597 51.46
RFQ
476K

Datasheet

476 Bulk Active Board Level Stud Mounted Diode Bolt On Rectangular, Fins 6.000" (152.40mm) 5.000" (127.00mm) - 5.000" (127.00mm) 50.0W @ 25°C 0.20°C/W @ 500 LFM 0.50°C/W Aluminum Black Anodized
HSET875-X-B

HSET875-X-B

HEATSINK WITH FAN FOR ET875-X7/

iBASE Technology

3,709 33.67
RFQ
HSET875-X-B

Datasheet

- Box Active - - - - - - - - - - - - -
V4511B

V4511B

PROFILE HEATSINK

Assmann WSW Components

3,399 0.00
RFQ

-

- Bulk Active - - - - - - - - - - - - -
HSIB903-BGA

HSIB903-BGA

AC, HEATSINK + FAN FOR IB903F/ I

iBASE Technology

3,534 45.45
RFQ

-

- Box Active Top Mount IB903F - - - - - - - - - - -
HSET875-1

HSET875-1

HEAT SPREADER FOR ET875-420/335

iBASE Technology

1,544 11.78
RFQ
HSET875-1

Datasheet

- Box Active - - - - - - - - - - - - -
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