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Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
OMNI-UNI-27-50 HEATSINK TO-247 TO-264 TO-220 Wakefield-Vette	2,235	4.39	RFQ	Datasheet	OmniKlip™	Bulk	Active	Board Level, Vertical	TO-220, TO-247, TO-264	Clip, Solder Foot	Rectangular, Fins	1.969" (50.00mm)	1.063" (27.00mm)	-	1.969" (50.00mm)	-	-	-	Aluminum	Black Anodized
528-45AB-T725 HEATSINK DC/DC HALF BRICK VERT Wakefield-Vette	3,446	3.45	RFQ	Datasheet	528	Bulk	Active	Board Level, Vertical	Half Brick DC/DC Converter	Bolt On, Thermal Material	Rectangular, Fins	2.400" (60.96mm)	2.280" (57.91mm)	-	0.450" (11.43mm)	7.0W @ 60°C	2.10°C/W @ 300 LFM	-	Aluminum	Black Anodized
662-15AG HEATSINK EXTRUSION 45MM Wakefield-Vette	1,526	1.83	RFQ	Datasheet	662	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.713" (43.51mm)	1.713" (43.51mm)	-	0.150" (3.81mm)	2.0W @ 30°C	8.00°C/W @ 200 LFM	-	Aluminum	Gold Iridite
601K HEATSINK FOR TO66 Wakefield-Vette	4,292	3.32	RFQ	Datasheet	601	Bulk	Active	Board Level	TO-66	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	2.000" (50.80mm)	1.250" (31.75mm)	-	0.562" (14.28mm)	5.0W @ 50°C	5.85°C/W @ 100 LFM	-	Aluminum	Black Anodized
7140DG BOARD LEVEL HEAT SINK Boyd Laconia, LLC	3,884	2.95	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Clip and PC Pin	Rectangular, Fins	0.700" (17.78mm)	0.900" (22.86mm)	-	0.375" (9.52mm)	1.5W @ 50°C	10.00°C/W @ 200 LFM	20.80°C/W	Copper	Tin
660-29ABT4E HEATSINK EXTRUSION 37MM Wakefield-Vette	1,542	1.47	RFQ	Datasheet	660	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.530" (38.86mm)	1.530" (38.86mm)	-	0.285" (7.24mm)	2.0W @ 30°C	7.00°C/W @ 100 LFM	-	Aluminum	Black Anodized
ATS-P1-165-C2-R0 HEATSINK 25X25X10MM R-TAB T766 Advanced Thermal Solutions Inc.	3,061	4.86	RFQ	Datasheet	pushPIN™	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.394" (10.00mm)	-	18.36°C/W @ 100 LFM	-	Aluminum	Blue Anodized
DA-T268-401E-TR TO-268 SMD HEAT SINK ANODZD Ohmite	1,680	2.10	RFQ	Datasheet	D	Tape & Reel (TR)	Active	Top Mount	TO-268 (D³Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.220" (30.99mm)	-	0.460" (11.68mm)	9.0W @ 43°C	5°C/W @ 500 LFM	-	Aluminum	Black Anodized
547-95AB HEATSINK DC/DC QUARTER BRICK Wakefield-Vette	2,216	3.37	RFQ	Datasheet	547	Bulk	Active	Board Level, Vertical	Quarter Brick DC/DC Converter	Bolt On, Thermal Material	Rectangular, Fins	1.450" (36.83mm)	2.280" (57.91mm)	-	0.950" (24.13mm)	-	2.20°C/W @ 300 LFM	-	Aluminum	Black Anodized
662-15ABT3 HEATSINK EXTRUSION 45MM Wakefield-Vette	1,040	2.42	RFQ	Datasheet	662	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.713" (43.51mm)	1.713" (43.51mm)	-	0.150" (3.81mm)	2.0W @ 30°C	8.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
326005R00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	1,555	3.19	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-5	Press Fit	Cylindrical	-	-	0.318" (8.07mm) ID, 0.500" (12.70mm) OD	0.375" (9.52mm)	1.8W @ 90°C	30.00°C/W @ 200 LFM	57.00°C/W	Aluminum	Red Anodized
659-65ABT4E HEATSINK EXTRUSION 37MM Wakefield-Vette	3,654	1.37	RFQ	Datasheet	659	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.450" (36.83mm)	1.450" (36.83mm)	-	0.650" (16.51mm)	2.0W @ 20°C	1.50°C/W @ 600 LFM	-	Aluminum	Black Anodized
591202B03100G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	4,606	3.02	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220, TO-262	Clip and PC Pin	Rectangular, Fins	0.600" (15.24mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 40°C	16.00°C/W @ 200 LFM	26.80°C/W	Aluminum	Black Anodized
660-29ABT5 HEATSINK EXTRUSION 37MM Wakefield-Vette	3,067	1.68	RFQ	Datasheet	660	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.530" (38.86mm)	1.530" (38.86mm)	-	0.285" (7.24mm)	2.0W @ 30°C	7.00°C/W @ 100 LFM	-	Aluminum	Black Anodized
501906B00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	4,518	3.05	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-66	Bolt On	Rhombus	1.550" (39.37mm)	1.040" (26.42mm)	-	1.000" (25.40mm)	4.0W @ 40°C	4.00°C/W @ 300 LFM	8.00°C/W	Aluminum	Black Anodized
374124B00032G BGA,374124B00032G Boyd Laconia, LLC	4,390	0.00	RFQ	-	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.709" (18.00mm)	-	7.39°C/W @ 200 LFM	23.40°C/W	Aluminum	Black Anodized
662-15AGT3 HEATSINK EXTRUSION 45MM Wakefield-Vette	3,396	2.33	RFQ	Datasheet	662	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.713" (43.51mm)	1.713" (43.51mm)	-	0.150" (3.81mm)	2.0W @ 30°C	8.00°C/W @ 200 LFM	-	Aluminum	Gold Iridite
662-15AGT5 HEATSINK EXTRUSION 45MM Wakefield-Vette	2,810	2.23	RFQ	Datasheet	662	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.713" (43.51mm)	1.713" (43.51mm)	-	0.150" (3.81mm)	2.0W @ 30°C	8.00°C/W @ 200 LFM	-	Aluminum	Gold Iridite
BDN17-3CB/A01 HEATSINK CPU W/ADHESIVE 1.71"SQ CTS Thermal Management Products	2,862	3.17	RFQ	Datasheet	BDN	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.710" (43.43mm)	1.710" (43.43mm)	-	0.355" (9.02mm)	-	3.80°C/W @ 400 LFM	11.50°C/W	Aluminum	Black Anodized
0372505020 CHIPSET COOLER #2 COPPER 6500RPM Molex	4,881	0.00	RFQ	-	-	Bulk	Obsolete	-	-	-	-	-	-	-	-	-	-	-	-	-

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