Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
577002B00000G HEAT SINK TO-220 .250" COMPACT Boyd Laconia, LLC	11,322	0.33	RFQ	Datasheet	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.250" (6.35mm)	1.5W @ 50°C	10.00°C/W @ 500 LFM	32.00°C/W	Aluminum	Black Anodized
V2022B HEATSINK CPU XCUT Assmann WSW Components	3,673	0.62	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.236" (6.00mm)	-	-	24.00°C/W	Aluminum Alloy	Black Anodized
240118ABHE22 HEATSINK TO-220 TWISTED FIN Wakefield-Vette	3,195	0.00	RFQ	Datasheet	240	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.180" (29.97mm)	0.570" (14.47mm)	-	0.500" (12.70mm)	4.0W @ 55°C	5.30°C/W @ 400 LFM	13.80°C/W	Aluminum	Black Anodized
HSS-B20-NP-12 HEATSINK TO-220 6.8W ALUMINUM Same Sky (Formerly CUI Devices)	1,157	0.61	RFQ	Datasheet	HSS	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.450" (36.83mm)	0.700" (17.80mm)	-	0.850" (21.60mm)	6.8W @ 75°C	3.47°C/W @ 200 LFM	14.33°C/W	Aluminum	Black Anodized
591302B02800G HEATSINK TO-220 W/INSTALL TAB Boyd Laconia, LLC	27,378	0.89	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220, TO-262	Clip and Board Locks	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 30°C	7.00°C/W @ 400 LFM	26.80°C/W	Aluminum	Black Anodized
V6560Y HEATSINK ALUM ANOD Assmann WSW Components	12,491	0.79	RFQ	Datasheet	-	Tray	Active	Board Level	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.969" (50.00mm)	1.181" (30.00mm)	-	0.472" (12.00mm)	-	-	7.00°C/W	Aluminum	Black Anodized
V5629W220 HEATSINK ALUM ANOD Assmann WSW Components	5,741	0.54	RFQ	Datasheet	-	Bulk	Active	Top Mount	TO-220	Bolt On and PC Pin	Square, Fins	0.984" (25.00mm)	0.449" (11.40mm)	-	0.260" (6.60mm)	-	-	36.00°C/W	Aluminum	Black Anodized
HSB01-080808 HEAT SINK, BGA, 8.5 X 8.5 X 8 MM Same Sky (Formerly CUI Devices)	2,653	0.73	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.335" (8.50mm)	0.335" (8.50mm)	-	0.315" (8.00mm)	1.9W @ 75°C	16.00°C/W @ 200 LFM	39.10°C/W	Aluminum Alloy	Black Anodized
V2027B HEATSINK CPU XCUT Assmann WSW Components	5,084	0.82	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.098" (27.90mm)	1.098" (27.90mm)	-	0.441" (11.20mm)	-	-	19.00°C/W	Aluminum Alloy	Black Anodized
HSB03-141406 HEAT SINK, BGA, 14 X 14 X 6 MM Same Sky (Formerly CUI Devices)	3,329	0.74	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.551" (14.00mm)	0.551" (14.00mm)	-	0.236" (6.00mm)	2.1W @ 75°C	15.80°C/W @ 200 LFM	35.98°C/W	Aluminum Alloy	Black Anodized
272-AB HEATSINK TO-220 SM FOOTPRINT BLK Wakefield-Vette	2,177	0.74	RFQ	Datasheet	272	Bulk	Active	Board Level	TO-220, TO-202	Bolt On and PC Pin	Rectangular, Fins	1.450" (36.83mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	4.0W @ 42°C	3.60°C/W @ 400 LFM	10.50°C/W	Aluminum	Black Anodized
V2020B HEATSINK CPU XCUT Assmann WSW Components	1,750	0.65	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.551" (14.00mm)	0.551" (14.00mm)	-	0.394" (10.00mm)	-	-	27.00°C/W	Aluminum Alloy	Black Anodized
V8813W HEATSINK TO-220/TOP-3/SOT-32 Assmann WSW Components	1,426	0.68	RFQ	Datasheet	-	Tray	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	0.984" (25.00mm)	1.359" (34.50mm)	-	0.492" (12.50mm)	-	-	6.50°C/W	Aluminum	Black Anodized
HSB18-232310 HEAT SINK, BGA, 23 X 23 X 10 MM Same Sky (Formerly CUI Devices)	4,224	1.04	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.394" (10.00mm)	3.7W @ 75°C	6.80°C/W @ 200 LFM	20.41°C/W	Aluminum Alloy	Black Anodized
V-1100-SMD/A HEATSINK TO-263 12.70X26.20MM Assmann WSW Components	1,855	0.71	RFQ	Datasheet	-	Tape & Reel (TR)	Active	Top Mount	TO-263 (D²Pak)	SMD Pad	Rectangular, Fins	0.500" (12.70mm)	1.031" (26.20mm)	-	0.390" (9.91mm)	-	-	23.00°C/W	Copper	Tin
HSE-B20250-040H-01 HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	1,145	0.79	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Angled Fins	0.984" (25.00mm)	1.359" (34.50mm)	-	0.492" (12.50mm)	5.5W @ 75°C	4.44°C/W @ 200 LFM	13.64°C/W	Aluminum Alloy	Black Anodized
506007B00000G HEATSINK TO-3 LOW PROFILE .375" Boyd Laconia, LLC	3,540	1.01	RFQ	Datasheet	-	Bag	Active	Board Level	TO-3	Bolt On	Rectangular, Fins	2.000" (50.80mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	10.0W @ 70°C	3.00°C/W @ 400 LFM	7.00°C/W	Aluminum	Black Anodized
ATS-PCB1025 HEATSINK TO-126 BLACK Advanced Thermal Solutions Inc.	4,414	0.87	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-126	Bolt On	Rectangular, Fins	0.560" (14.22mm)	0.620" (15.75mm)	-	0.370" (9.40mm)	-	19.00°C/W @ 200 LFM	33.00°C/W	Aluminum	Black Anodized
ATS-PCB1064 HEATSINK TO-220 CLIP-ON BLACK Advanced Thermal Solutions Inc.	1,471	0.87	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Clip	Rectangular, Fins	0.748" (19.00mm)	0.504" (12.80mm)	-	0.500" (12.70mm)	-	10.20°C/W @ 200 LFM	27.30°C/W	Aluminum	Black Anodized
HSB08-212106 HEAT SINK, BGA, 21 X 21 X 6 MM Same Sky (Formerly CUI Devices)	1,436	0.89	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.236" (6.00mm)	3.0W @ 75°C	9.70°C/W @ 200 LFM	25.40°C/W	Aluminum Alloy	Black Anodized

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