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Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
HSB25-282810 HEAT SINK, BGA, 28.5 X 28.5 X 10 Same Sky (Formerly CUI Devices)	1,544	1.30	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.122" (28.50mm)	1.122" (28.50mm)	-	0.394" (10.00mm)	4.87W @ 75°C	5.10°C/W @ 200 LFM	15.41°C/W	Aluminum Alloy	Black Anodized
7139DG HEATSINK TO-220 TIN CLIP-ON 13MM Boyd Laconia, LLC	3,129	1.40	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Clip and PC Pin	Rectangular, Fins	0.780" (19.81mm)	0.520" (13.21mm)	-	0.515" (13.08mm)	1.5W @ 50°C	8.00°C/W @ 500 LFM	28.30°C/W	Copper	Tin
531002B00000G HEATSINK TO-220 BLACK 1" Boyd Laconia, LLC	2,312	1.71	RFQ	Datasheet	-	Box	Active	Board Level, Vertical	TO-220, TO-202	Bolt On	Rectangular, Fins	1.000" (25.40mm)	1.375" (34.93mm)	-	0.500" (12.70mm)	3.0W @ 40°C	4.00°C/W @ 400 LFM	13.40°C/W	Aluminum	Black Anodized
529802B00000G HEATSINK TO-220 10W H=1.5" BLK Boyd Laconia, LLC	8,427	1.76	RFQ	Datasheet	-	Box	Active	Board Level, Vertical	TO-220	Bolt On	Rectangular, Fins	1.500" (38.10mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	8.0W @ 40°C	2.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
575703B00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	2,133	1.77	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-3	Bolt On	Rhombus	1.630" (41.40mm)	1.290" (32.77mm)	-	0.750" (19.05mm)	2.0W @ 30°C	4.00°C/W @ 200 LFM	13.40°C/W	Aluminum	Black Anodized
6030D(COPPER)G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	432	1.40	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	1.0W @ 20°C	6.00°C/W @ 300 LFM	12.50°C/W	Copper	Tin
V5220X HEATSINK ANOD ALUM W/PIN TO-220 Assmann WSW Components	606	1.24	RFQ	Datasheet	-	Tray	Active	Board Level, Vertical	TO-220	Bolt On	Rectangular, Fins	1.476" (37.50mm)	1.260" (32.00mm)	-	0.787" (19.99mm)	-	-	8.00°C/W	Aluminum	Black Anodized
TGH-0130-03 ALUMINIUM HEAT SINK 35X13MM t-Global Technology	297	1.40	RFQ	Datasheet	TGH	Bulk	Active	Top Mount	-	-	Rectangular, Fins	1.378" (35.00mm)	0.512" (13.00mm)	-	0.236" (6.00mm)	-	-	-	Aluminum	Black Anodized
ATS-PCB1074 HEATSINK TO-263 COPPER Advanced Thermal Solutions Inc.	11,043	1.45	RFQ	Datasheet	-	Tape & Reel (TR)	Active	Top Mount	TO-263 (D²Pak)	-	Rectangular, Fins	0.500" (12.70mm)	1.031" (26.20mm)	-	0.401" (10.20mm)	-	9.50°C/W @ 200 LFM	18.00°C/W	Copper	Tin
V2277E1 CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	292	1354.00	RFQ	Datasheet	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.394" (10.00mm)	-	-	26.00°C/W	Aluminum Alloy	Black Anodized
576802B03100G HEAT SINK HORIZ PLUG-IN TO-220 Boyd Laconia, LLC	13,633	1.37	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220, TO-262	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 30°C	7.00°C/W @ 400 LFM	27.30°C/W	Aluminum	Black Anodized
625-45AB HEATSINK CPU 25MM SQ H=.45" BLK Wakefield-Vette	2,168	1.54	RFQ	Datasheet	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.450" (11.43mm)	-	8.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
529701B02500G HEATSINK TO-218 SOLDER PIN Boyd Laconia, LLC	16,835	4.26	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	12.0W @ 70°C	4.00°C/W @ 200 LFM	5.50°C/W	Aluminum	Black Anodized
M47118B011000G MAX CLIP HEATSINK Boyd Laconia, LLC	607	1.58	RFQ	Datasheet	Max Clip System™	Bulk	Active	Board Level, Vertical	TO-126, TO-220, TO-247	Clip and PC Pin	Rectangular, Angled Fins	1.180" (29.97mm)	0.764" (19.40mm)	-	1.240" (31.50mm)	-	-	-	Aluminum	Black Anodized
HSB15-404010 HEAT SINK, BGA, 40 X 40 X 10 MM Same Sky (Formerly CUI Devices)	202	1.58	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.394" (10.00mm)	6.3W @ 75°C	3.90°C/W @ 200 LFM	11.84°C/W	Aluminum Alloy	Black Anodized
579103B00000G HEATSINK TO-3 BLACK .87" Boyd Laconia, LLC	1,075	1.61	RFQ	Datasheet	-	Bag	Active	Top Mount	TO-3	Bolt On	Rhombus	1.540" (39.12mm)	-	1.125" (28.57mm) OD	0.870" (22.10mm)	2.5W @ 40°C	4.00°C/W @ 600 LFM	12.50°C/W	Aluminum	Black Anodized
HSS01-B20-CP HEAT SINK, STAMPING, TO-220, 49. Same Sky (Formerly CUI Devices)	975	1.61	RFQ	Datasheet	HSS	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular	1.941" (49.31mm)	1.900" (48.26mm)	-	0.950" (24.13mm)	9.9W @ 75°C	3.70°C/W @ 200 LFM	7.59°C/W	Aluminum Alloy	Black Anodized
HSB14-353518 HEAT SINK, BGA, 35 X 35 X 18 MM Same Sky (Formerly CUI Devices)	681	1.65	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.709" (18.00mm)	8.4W @ 75°C	3.60°C/W @ 200 LFM	8.97°C/W	Aluminum Alloy	Black Anodized
TGH-0220-06 ALUMINIUM HEAT SINK 27X22MM t-Global Technology	229	1.60	RFQ	Datasheet	TGH	Bulk	Active	Top Mount	-	-	Rectangular, Pin Fins	1.063" (27.00mm)	0.866" (22.00mm)	-	0.354" (9.00mm)	-	-	-	Aluminum	Black Anodized
534202B02853G HEATSINK TO-220 W/SHURLOCK-CLIP Boyd Laconia, LLC	19,247	1.70	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Clip and Board Locks	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	1.0W @ 20°C	6.00°C/W @ 300 LFM	13.40°C/W	Aluminum	Black Anodized

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