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Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
658-35AB HEATSINK CPU 28MM SQBLK W/O TAPE Wakefield-Vette	13,852	1.09	RFQ	Datasheet	658	Tray	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.350" (8.89mm)	-	3.00°C/W @ 800 LFM	-	Aluminum	Black Anodized
V2268E1 CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	1,929	2562.00	RFQ	Datasheet	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.236" (6.00mm)	-	-	30.00°C/W	Aluminum Alloy	Black Anodized
HSE-B20254-040H HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	2,107	1.12	RFQ	Datasheet	HSE	Bag	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.260" (32.00mm)	-	0.551" (14.00mm)	5.7W @ 75°C	7.74°C/W @ 200 LFM	13.16°C/W	Aluminum Alloy	Black Anodized
HSE-B20250-045H HEAT SINK, EXTRUSION, TO-220, 50 Same Sky (Formerly CUI Devices)	868	1.11	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.969" (50.00mm)	1.181" (30.00mm)	-	0.472" (12.00mm)	7.7W @ 75°C	4.05°C/W @ 200 LFM	9.74°C/W	Aluminum Alloy	Black Anodized
V2269E1 CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	1,083	1223.00	RFQ	Datasheet	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.787" (20.00mm)	0.787" (20.00mm)	-	0.354" (9.00mm)	-	-	27.00°C/W	Aluminum Alloy	Black Anodized
576802B03900G HEATSINK TO220 CLIPON W/TAB.75" Boyd Laconia, LLC	15,144	2.29	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220, TO-262	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 30°C	7.00°C/W @ 400 LFM	27.30°C/W	Aluminum	Black Anodized
7142DG HEATSINK TO-220 TIN CLIP-ON 21MM Boyd Laconia, LLC	4,435	2.76	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Clip and Board Locks	Rectangular, Fins	0.780" (19.81mm)	0.520" (13.21mm)	-	0.515" (13.08mm)	1.0W @ 30°C	8.00°C/W @ 400 LFM	20.30°C/W	Copper	Tin
HSB26-343408 HEAT SINK, BGA, 33.5 X 33.5 X 8 Same Sky (Formerly CUI Devices)	524	1.14	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.319" (33.50mm)	1.319" (33.50mm)	-	0.315" (8.00mm)	4.94W @ 75°C	5.30°C/W @ 200 LFM	15.19°C/W	Aluminum Alloy	Black Anodized
7173DG BOARD LEVEL HEATSINK .375"TO-220 Boyd Laconia, LLC	5,532	0.67	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.750" (19.05mm)	-	0.375" (9.52mm)	1.5W @ 50°C	10.00°C/W @ 200 LFM	25.80°C/W	Copper	Tin
658-45AB HEATSINK CPU 28MM SQBLK W/O TAPE Wakefield-Vette	2,642	1.17	RFQ	Datasheet	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.450" (11.43mm)	3.0W @ 50°C	6.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
HSE-B250-04H HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	2,215	1.07	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.984" (25.00mm)	1.378" (35.00mm)	-	1.000" (25.40mm)	8.0W @ 75°C	3.26°C/W @ 200 LFM	13.60°C/W	Aluminum Alloy	Black Anodized
HSE-B20500-040H HEAT SINK, EXTRUSION, TO-220, 50 Same Sky (Formerly CUI Devices)	727	1.17	RFQ	Datasheet	HSE	Tray	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.969" (50.00mm)	1.378" (35.00mm)	-	0.492" (12.50mm)	8.9W @ 75°C	4.85°C/W @ 200 LFM	8.43°C/W	Aluminum Alloy	Black Anodized
574902B03300G HEATSINK TO-220 VERT MNT W/TAB Boyd Laconia, LLC	5,561	1.19	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular	1.375" (34.93mm)	0.860" (21.84mm)	-	0.395" (10.03mm)	2.5W @ 40°C	6.00°C/W @ 400 LFM	16.00°C/W	Aluminum	Black Anodized
651-B HEATSINK 14-16PIN DIP BLK Wakefield-Vette	1,025	1.21	RFQ	Datasheet	651	Bulk	Active	Top Mount	14-DIP and 16-DIP	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	0.750" (19.05mm)	0.415" (10.54mm)	-	0.240" (6.10mm)	0.5W @ 40°C	40.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
V5619B HEATSINK ALUM ANOD Assmann WSW Components	3,025	1.35	RFQ	Datasheet	-	Bulk	Active	Top Mount	24-DIP	Press Fit	Rectangular, Fins	1.299" (32.99mm)	0.748" (19.00mm)	-	0.189" (4.80mm)	-	-	48.00°C/W	Aluminum	Black Anodized
ATS-PCB1029 HEATSINK TO-220 BLACK Advanced Thermal Solutions Inc.	6,605	1.25	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.000" (25.40mm)	1.551" (39.40mm)	-	0.374" (9.50mm)	-	6.80°C/W @ 200 LFM	11.00°C/W	Aluminum	Black Anodized
V8813Y HEATSINK TO-220/TOP-3/SOT-32 Assmann WSW Components	399	1.09	RFQ	Datasheet	-	Tray	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	1.969" (50.00mm)	1.359" (34.50mm)	-	0.492" (12.50mm)	-	-	8.80°C/W	Aluminum	Black Anodized
HSB11-252518 HEAT SINK, BGA, 25 X 25 X 18 MM Same Sky (Formerly CUI Devices)	2,722	1.28	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.709" (18.00mm)	5.5W @ 75°C	4.50°C/W @ 200 LFM	13.70°C/W	Aluminum Alloy	Black Anodized
XL25W-12-12-10 CERAMIC HEAT SINK 12X12X10MM WHI t-Global Technology	2,324	1.27	RFQ	Datasheet	XL-25	Bulk	Active	Heat Spreader	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape	Square	0.472" (12.00mm)	0.472" (12.00mm)	-	0.394" (10.00mm)	-	-	-	Ceramic	-
657-15ABPEN HEATSINK TO-220 W/PINS BLK 1.5" Wakefield-Vette	2,871	1.66	RFQ	Datasheet	657	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.500" (38.10mm)	6.0W @ 38°C	3.30°C/W @ 200 LFM	-	Aluminum	Black Anodized

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