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Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
HSB12-272706 HEAT SINK, BGA, 27 X 27 X 6 MM Same Sky (Formerly CUI Devices)	1,101	0.89	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.236" (6.00mm)	3.8W @ 75°C	7.80°C/W @ 200 LFM	19.59°C/W	Aluminum Alloy	Black Anodized
HSB03-121218 HEAT SINK, BGA, 12 X 12 X 18 MM Same Sky (Formerly CUI Devices)	1,500	0.91	RFQ	Datasheet	HSB	Tray	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.472" (12.00mm)	0.472" (12.00mm)	-	0.709" (18.00mm)	3.1W @ 75°C	9.60°C/W @ 200 LFM	24.01°C/W	Aluminum Alloy	Black Anodized
V8813X HEATSINK TO-220/TOP-3/SOT-32 Assmann WSW Components	3,288	0.81	RFQ	Datasheet	-	Tray	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	1.496" (38.00mm)	1.359" (34.50mm)	-	0.492" (12.50mm)	-	-	5.00°C/W	Aluminum	Black Anodized
HSB09-212115 HEAT SINK, BGA, 21 X 21 X 15 MM Same Sky (Formerly CUI Devices)	2,583	0.93	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.591" (15.00mm)	4.3W @ 75°C	6.00°C/W @ 200 LFM	17.39°C/W	Aluminum Alloy	Black Anodized
ATS-PCBT1095 HEATSINK TO-252 D-PAK COPPER Advanced Thermal Solutions Inc.	2,641	0.93	RFQ	Datasheet	-	Bulk	Active	Top Mount	TO-252 (DPak)	-	Rectangular, Fins	0.315" (8.00mm)	0.842" (21.40mm)	-	0.400" (10.16mm)	-	21.00°C/W @ 200 LFM	28.00°C/W	Copper	Tin
507222B05300G HEAT SINK Boyd Laconia, LLC	1,149	0.95	RFQ	Datasheet	Hat Section 5070	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.375" (9.53mm)	1.750" (44.45mm)	-	1.470" (37.34mm)	-	-	-	Aluminum	Black Anodized
501200B00000G HEATSINK 14-16 DIP BLACK .19" Boyd Laconia, LLC	1,013	0.80	RFQ	Datasheet	-	Bag	Active	Top Mount	14-DIP and 16-DIP	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	0.250" (6.35mm)	0.731" (18.57mm)	-	0.190" (4.83mm)	0.4W @ 30°C	50.00°C/W @ 200 LFM	68.00°C/W	Aluminum	Black Anodized
ATS-PCB1073 HEATSINK TO-263 COPPER Advanced Thermal Solutions Inc.	116,590	1.17	RFQ	Datasheet	-	Bulk	Active	Top Mount	TO-263 (D²Pak)	-	Rectangular, Fins	0.500" (12.70mm)	1.031" (26.20mm)	-	0.402" (10.21mm)	-	9.50°C/W @ 200 LFM	18.00°C/W	Copper	Tin
HSS24-B20-NP HEAT SINK, STAMPING, TO-218/TO-2 Same Sky (Formerly CUI Devices)	2,779	0.98	RFQ	Datasheet	HSS	Box	Active	Top Mount	TO-218, TO-220	Bolt On	Rectangular, Fins	1.654" (42.00mm)	1.496" (38.00mm)	-	0.984" (25.00mm)	7.85W @ 75°C	4.30°C/W @ 200 LFM	9.56°C/W	Aluminum Alloy	Black Anodized
V7477W HEATSINK TOP-3 TO-220 SOT-32 Assmann WSW Components	1,624	0.85	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.374" (34.90mm)	-	0.500" (12.70mm)	-	-	14.00°C/W	Aluminum	Black Anodized
HSE-B20350-NP HEAT SINK, EXTRUSION, TO-220, 35 Same Sky (Formerly CUI Devices)	1,436	0.94	RFQ	Datasheet	HSE	Tray	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.378" (35.00mm)	1.142" (29.00mm)	-	0.472" (12.00mm)	6.2W @ 75°C	2.91°C/W @ 200 LFM	12.10°C/W	Aluminum Alloy	Black Anodized
HSE-B20380-040H HEAT SINK, EXTRUSION, TO-220, 38 Same Sky (Formerly CUI Devices)	1,254	0.98	RFQ	Datasheet	HSE	Tray	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.496" (38.00mm)	1.378" (35.00mm)	-	0.492" (12.50mm)	7.4W @ 75°C	3.94°C/W @ 200 LFM	10.14°C/W	Aluminum Alloy	Black Anodized
V7466X HEATSINK ALUM ANOD Assmann WSW Components	2,926	0.89	RFQ	Datasheet	-	Tray	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.772" (45.00mm)	-	0.500" (12.70mm)	-	-	7.00°C/W	Aluminum	Black Anodized
V5220W HEATSINK ANOD ALUM W/PIN TO-220 Assmann WSW Components	1,938	0.92	RFQ	Datasheet	-	Tray	Active	Board Level, Vertical	TO-220	Bolt On	Rectangular, Fins	0.984" (25.00mm)	1.260" (32.00mm)	-	0.787" (19.99mm)	-	-	10.00°C/W	Aluminum	Black Anodized
HSB06-181810 HEAT SINK, BGA, 18 X 18 X 10 MM Same Sky (Formerly CUI Devices)	1,111	1.02	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.709" (18.00mm)	0.709" (18.00mm)	-	0.394" (10.00mm)	3.2W @ 75°C	18.80°C/W @ 200 LFM	23.68°C/W	Aluminum Alloy	Black Anodized
HSE-B20381-035H HEAT SINK, EXTRUSION, TO-220, 38 Same Sky (Formerly CUI Devices)	394	1.04	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.500" (38.10mm)	1.375" (34.93mm)	-	0.500" (12.70mm)	6.5W @ 75°C	3.66°C/W @ 200 LFM	11.54°C/W	Aluminum Alloy	Black Anodized
201835 SILENTSTEPSTICK HEATSINK 14.5 X Watterott Electronic GmbH	175	1.11	RFQ	Datasheet	-	Bulk	Active	Top Mount	Stepper Motor Driver Board	Thermal Tape, Adhesive (Included)	Rectangular, Fins	0.591" (15.00mm)	0.571" (14.50mm)	-	0.512" (13.00mm)	-	-	-	Aluminum	Black Anodized
508500B00000G HEATSINK 24-PIN DIP GLUE-ON BLK Boyd Laconia, LLC	6,732	1.06	RFQ	Datasheet	-	Bag	Active	Top Mount	24-DIP	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	1.250" (31.75mm)	0.530" (13.46mm)	-	0.190" (4.83mm)	1.0W @ 40°C	15.00°C/W @ 500 LFM	34.00°C/W	Aluminum	Black Anodized
V2286B CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	494	3452.00	RFQ	Datasheet	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.551" (14.00mm)	0.551" (14.00mm)	-	0.236" (6.00mm)	-	-	32.00°C/W	Aluminum Alloy	Black Anodized
V7700W HEATSINK ALUM ANOD Assmann WSW Components	8,275	0.98	RFQ	Datasheet	-	Tray	Active	Board Level, Vertical	SOT-32, TO-220	Bolt On	Square, Pin Fins	0.984" (25.00mm)	0.625" (16.00mm)	-	0.630" (16.00mm)	-	-	24.00°C/W	Aluminum	Black Anodized

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