Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
530714B00000G HEATSINK TO-220 LIGHTWEIGHT .5" Boyd Laconia, LLC	1,484	2.18	RFQ	Datasheet	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.710" (18.03mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	2.0W @ 40°C	4.00°C/W @ 700 LFM	20.30°C/W	Aluminum	Black Anodized
HSB30-373710 HEAT SINK, BGA, 37.4 X 37 X 10 M Same Sky (Formerly CUI Devices)	172	2.24	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.472" (37.39mm)	1.472" (37.39mm)	-	0.394" (10.00mm)	6.45W @ 75°C	4°C/W @ 200 LFM	11.63°C/W	Aluminum Alloy	Black Anodized
655-53AB HEATSINK CPU 40.6MM SQ H=.525" Wakefield-Vette	3,411	2.19	RFQ	Datasheet	655	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.600" (40.64mm)	1.600" (40.64mm)	-	0.522" (13.27mm)	4.0W @ 40°C	2.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
V2030B HEATSINK CPU FORGED Assmann WSW Components	564	2.22	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.256" (6.50mm)	-	-	6.00°C/W	Aluminum Alloy	Black Anodized
DV-T268-301E-TR HEATSINK FOR TO-268 Ohmite	3,971	2.44	RFQ	Datasheet	D	Tape & Reel (TR)	Active	Top Mount	TO-268 (D³Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.580" (40.13mm)	-	0.460" (11.68mm)	7.0W @ 35°C	4.00°C/W @ 700 LFM	-	Aluminum	Degreased
504222B00000G HEATSINK TO-220 PWR CLR 1.45"10W Boyd Laconia, LLC	2,583	0.65	RFQ	Datasheet	-	Bag	Active	Board Level	TO-220 (Dual)	Bolt On	Rectangular, Fins	1.450" (36.83mm)	0.780" (19.81mm)	-	0.850" (21.60mm)	4.0W @ 40°C	5.00°C/W @ 200 LFM	6.40°C/W	Aluminum	Black Anodized
M48118B011000G MAX CLIP HEATSINK Boyd Laconia, LLC	6,174	1.82	RFQ	Datasheet	Max Clip System™	Bulk	Active	Board Level, Vertical	TO-126, TO-220, TO-247	Clip and PC Pin	Rectangular, Angled Fins	1.180" (29.97mm)	0.866" (22.00mm)	-	1.516" (38.50mm)	-	-	-	Aluminum	Black Anodized
HSB16-404018 HEAT SINK, BGA, 40 X 40 X 18 MM Same Sky (Formerly CUI Devices)	1,049	2.23	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.709" (18.00mm)	9.4W @ 75°C	2.60°C/W @ 200 LFM	7.96°C/W	Aluminum Alloy	Black Anodized
580100B00000G HEATSINK SLIDE-ON 8-DIP Boyd Laconia, LLC	574	2.25	RFQ	Datasheet	-	Bulk	Active	Top Mount	8-DIP	Press Fit, Slide On	Rectangular, Fins	0.562" (14.27mm)	0.600" (15.24mm)	-	0.450" (11.43mm)	1.0W @ 30°C	8.00°C/W @ 500 LFM	30.00°C/W	Aluminum	Black Anodized
HSB40-252510P HEAT SINK, BGA, 25 X 25 X 10 MM, Same Sky (Formerly CUI Devices)	346	0.00	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.394" (10.00mm)	4.2W @ 75°C	6.00°C/W @ 200 LFM	17.87°C/W	Aluminum Alloy	Black Anodized
576602B00000G HEATSINK TO-220 VERT MNT .95" Boyd Laconia, LLC	3,037	1.25	RFQ	Datasheet	-	Bag	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.950" (24.13mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	1.0W @ 20°C	9.00°C/W @ 200 LFM	16.60°C/W	Aluminum	Black Anodized
TGH-0220-03 ALUMINIUM HEAT SINK 22X22MM t-Global Technology	670	2.29	RFQ	Datasheet	TGH	Bulk	Active	Top Mount	-	-	Square, Pin Fins	0.866" (22.00mm)	0.866" (22.00mm)	-	0.354" (9.00mm)	-	-	-	Aluminum	Black Anodized
507222B00000G HEATSINK TO-220 DUAL 10W Boyd Laconia, LLC	339	2.20	RFQ	Datasheet	Hat Section 5070	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.470" (37.34mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	8.0W @ 70°C	3.00°C/W @ 200 LFM	9.60°C/W	Aluminum	Black Anodized
V4330K HEATSINK ANOD ALUM Assmann WSW Components	2,003	1.93	RFQ	Datasheet	-	Bulk	Active	Board Level	KLP	Bolt On	Rectangular, Fins	1.476" (37.50mm)	1.142" (29.00mm)	-	0.472" (12.00mm)	-	-	11.00°C/W	Aluminum	Black Anodized
E2A-T220-38E BLACK ANODIZED HEATSINK Ohmite	144	2.07	RFQ	Datasheet	EX	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and Board Mounts	Rectangular, Fins	0.641" (16.28mm)	0.642" (16.30mm)	-	1.500" (38.10mm)	3.0W @ 50°C	5.00°C/W @ 200 LFM	14.00°C/W	Aluminum	Black Anodized
FA-T220-51E HEATSINK TO-218,TO-220,TO-247 Ohmite	1,499	2.63	RFQ	Datasheet	F	Box	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	4.0W @ 20°C	2.00°C/W @ 300 LFM	3.40°C/W	Aluminum	Black Anodized
V8818V HEATSINK ALUM ANOD Assmann WSW Components	488	2.11	RFQ	Datasheet	-	Tray	Active	Board Level	SOT-32, TO-220	Bolt On and PC Pin	Rectangular, Fins	2.362" (60.00mm)	0.748" (19.00mm)	-	0.844" (21.44mm)	-	-	7.50°C/W	Aluminum	Black Anodized
658-25ABT3 HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	3,605	2.32	RFQ	Datasheet	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
HSB17-404025 HEAT SINK, BGA, 40 X 40 X 25 MM Same Sky (Formerly CUI Devices)	596	2.53	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.984" (25.00mm)	11.7W @ 75°C	2.10°C/W @ 200 LFM	6.41°C/W	Aluminum Alloy	Black Anodized
HSB27-434316 HEAT SINK, BGA, 43.1 X 43.1 X 16 Same Sky (Formerly CUI Devices)	916	2.60	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.697" (43.10mm)	1.697" (43.10mm)	-	0.650" (16.51mm)	8.98W @ 75°C	2.80°C/W @ 200 LFM	8.35°C/W	Aluminum Alloy	Black Anodized

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